Small LCD TV screen TAB COF ic bonding machine
Application of machine:
This product is used for various FPC, COF, TAB, COG and LCD/LED Panel and PCB combination binding. It is embodied in various sizes of LCD vertical lines, horizontal lines, vertical bands, cross bands, black belts, black lines, Color line, ribbon, multi-line, flower screen, black screen, white screen, vertical half display, horizontal half display and other fault repair.
Product description:
For the current LCD panel manufacturers (such as Chi Mei Optoelectronics, AUO, Huaxing Optoelectronics, LG, Samsung, etc.) continue to introduce a variety of new 4K screen, large-size LCD panels and other high-intensity-intensive lines. In order to better improve LCD screen repair Successful yield and reduced rework, the company took the lead in research and development and launched a new high-end maintenance pressure screen machine. The equipment research and development aims to make major changes and upgrades without guaranteeing the price, and the first original machine used in Japan is Olympus. Professional-grade microscope test LCD screen after the hot pressing of the index of conductive rubber particles blasting, more intuitive and ensure that the machine reaches the most accurate temperature parameters.
Features:
1, PLC control, pulse heating mode, combined with titanium alloy extrusion head, rapid heating and rapid cooling, can be set up four heating, accurate temperature control.
2, 5.7 "color touch screen LCD display input, realizing the temperature curve, according to the Chinese menu, all the parameters set browse concise and straightforward.
3, large load platform, stepper motor drive, multiple IC can be preset position, the platform automatically move the pressure to stay.
4, para way under the high magnification camera system, ensure that the product clearly counterpoint.
5, powerful software, perfect the system debugging, automatically detect fault and alarm function.
Application: suitable for 12-80inch TFT panel and TAB, FPC and LCD or PCB board combination bonding.
Technical parameters:
| Model | 815S |
| power: | AC220V±10%, 50Hz, 4500W |
| work environment: | 10~60℃, 40%~ 95% |
| work air pressure: | 0.5 ~ 0.7 Mpa |
| bonding press stress: | 5 ~ 28 KGF |
| temperature Settings: | one to four paragraphs |
| temperature Settings: | RT ~ 399 ℃ |
| hot pressing time: | 1 ~ 99 s |
| hot-pressing precision: | pitch 45um |
| production capacity: | 35 s/TAB or COF package |
| hot pressing head size: | MAX 60 x 8 mm |
| the fuselage size: | 1508 mm (L) x 1245 mm (W) x 1483 mm (H) |
| weight: | about 260 kg |
Q1:If I order today, how long it takes for the shipment?
A: Our dilivery time is about 7-10days after accept your payment.
Q2. What’s the payment terms?
We accept Trade Assurance, credit card ,T/T, 50% upon order placed, 50% before shipment.
Q3.Can I get a sample?
No. machine is big item. not support sample.
Q4.Can I get training?
Yes. Training is free in our factory. Customer can study all technology and repairing for 1 week. Also we can send traning video for customer self learning.
Q5. Is there accessories with machine?
Yes. 21 items of accessories included with machine. Customer can start repairing work easily when receive machine.
Product Tags:
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4500W OLED Open Cell Panel TAB IC COF Bonding Machine Images
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